Air Flow Optimisations

Pressure Differential Flow Design (PDF)
Conical tunnels create an air pressure difference, which increases the airflow up to 15% and allows the heat to be dissipated more quickly.

Vortex Generator Flow (VGF)
In aviation, spoilers, the so-called vortex generators, are used to guide the airflow evenly along with the wings. Enermax engineers have applied this technology to the CPU heat sink: Small spoilers on the fins next to the heat pipes create a vortex which brings more fresh air to the back of the heat pipes.

Vacuum Effect Flow (VEF)
The partially closed sides of the heat sink create a vacuum that additionally draws fresh air from the side.

Heat Pipe Direct Touch (HDT)

With the patented Heat Pipe Direct Touch technology, the heat pipes rest directly on the CPU. The advantage against a base plate is the faster transfer of heat without any additional resistance.

Asymmetric Heat Pipe Design

The asymmetrical heat pipe design creates additional space for the fan to prevent high RAM modules from being blocked.

Enermax High Pressure Blade

The ETS-T50 AXE Silent Edition is equipped with a 14cm High-Pressure Blade fan designed for use on CPU coolers. The patented Twister Bearing technology ensures smooth operation and long service life of up to 160,000 hours MTBF.
The 9 High-Pressure Blades rotate at 500 – 1.000 RPM to ensure ultra-silent operation.

Thermal Conductive Coating

The Thermal Conductive Coating is a thin protective layer that prevents oxidation without compromising the heat transfer.

Air Guide

The Air Guide on the back of the cooler provides airflow control for perfect adaptation to the needs of the case.

Compatibility

Quick & user-friendly universal mounting system supporting Intel® and AMD® sockets (excluding TR4/SP3 socket). The pressure adjustment spring system and high conductive Dow-Corning® thermal grease ensure perfect contact with the CPUs heat spreader.